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Patent Searching and Data


Title:
MOLD, DEVICE FOR MOLDING RESIN, AND METHOD FOR PRODUCING MOLDED RESIN ARTICLE
Document Type and Number:
WIPO Patent Application WO/2024/014060
Kind Code:
A1
Abstract:
A mold (C) comprising: a lower mold (LM) comprising lower-mold cavity blocks (53) and a pot block (54) having a pot (54b) formed; an upper mold (UM) comprising upper-mold cavity blocks (64) and a cull block (65) disposed over the pot block (54) and capable of ascending and descending independently of the upper-mold cavity blocks (64); first elastic members (55), which push the lower-mold cavity blocks (53) toward the upper mold (UM); a plurality of support members (63) which push the upper-mold cavity blocks (64) and the cull block (65) and are elastically deformable; and a second elastic member (66) which pushes the cull block (65) and can cause the cull block (65) to protrude downward from the lower surfaces of the upper-mold cavity blocks (64).

Inventors:
MOROHASHI NOBUYUKI (JP)
Application Number:
PCT/JP2023/010929
Publication Date:
January 18, 2024
Filing Date:
March 20, 2023
Export Citation:
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Assignee:
TOWA CORP (JP)
International Classes:
B29C45/02; B29C33/10; B29C45/26; B29C45/34; H01L21/56
Foreign References:
JP2017007170A2017-01-12
JP2016152305A2016-08-22
JP2001168121A2001-06-22
Attorney, Agent or Firm:
R&C IP LAW FIRM (JP)
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