Title:
MOLD, METHOD FOR MANUFACTURING MOLD, AND METHOD FOR MANUFACTURING FINE IRREGULARITY STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/054527
Kind Code:
A1
Abstract:
Provided are a mold having excellent releasability and transferability, a method for manufacturing a mold, and a method for manufacturing a fine irregularity structure. A mold (1) is provided with a base material (10) having a fine irregularity structure on a surface thereof, and a sputtered layer (20) formed on the surface of the fine irregularity structure and having an oxide film (21) on an outermost surface thereof. The sputtered layer (20) having the oxide film (21) formed on the outermost surface thereof provides the mold (1) with excellent releasability and transferability.
Inventors:
SHIMIZU DAIKI (JP)
KAJIYA SHUNICHI (JP)
KAJIYA SHUNICHI (JP)
Application Number:
PCT/JP2022/036292
Publication Date:
April 06, 2023
Filing Date:
September 28, 2022
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
B29C59/04; B29C33/42; B29C59/02; H01L21/027
Domestic Patent References:
| WO2012018048A1 | 2012-02-09 |
Foreign References:
| JP2016523449A | 2016-08-08 | |||
| JP2007144995A | 2007-06-14 | |||
| JP2008217845A | 2008-09-18 | |||
| KR100663263B1 | 2007-01-02 | |||
| US20050230882A1 | 2005-10-20 |
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
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