Title:
MOLD AND METHOD FOR PRODUCING MOLD
Document Type and Number:
WIPO Patent Application WO/2016/027827
Kind Code:
A1
Abstract:
A mold (100) is provided with an aluminum base material (12) and a porous alumina layer (14) that is formed on the aluminum base material. The porous alumina layer is in the shape of a cylinder having, on the surface (18s) thereof, a plurality of micro-recesses (14p) having two-dimensional sizes of not less than 10 nm but less than 500 nm when viewed in the normal direction of the surface. The porous alumina layer also has, on the side surface thereof, at least one marker section (50) that defines a position in the circumferential direction of the mold. The maximum height Rz of the at least one marker section is greater than 500 nm, and the arithmetic mean roughness Ra of the at least one marker section is 300 nm or less.
Inventors:
YAMADA NOBUAKI
MATSUMURA RYOHZOH
NAKAMATSU KENICHIRO
MATSUMURA RYOHZOH
NAKAMATSU KENICHIRO
Application Number:
PCT/JP2015/073212
Publication Date:
February 25, 2016
Filing Date:
August 19, 2015
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
B29C59/04; B29C33/38; C25D11/04
Domestic Patent References:
| WO2014104308A1 | 2014-07-03 | |||
| WO2011111697A1 | 2011-09-15 | |||
| WO2012124498A1 | 2012-09-20 | |||
| WO2009144970A1 | 2009-12-03 |
Foreign References:
| JP2014139667A | 2014-07-31 | |||
| JP2013166317A | 2013-08-29 |
Attorney, Agent or Firm:
OKUDA SEIJI (JP)
Seiji Okuda (JP)
Seiji Okuda (JP)
Download PDF:
Previous Patent: POROUS BODY DYEING METHOD, PHOTOELECTRODE AND PHOTOELECTRIC MODULE
Next Patent: BEARING-EQUIPPED RESIN PULLEY
Next Patent: BEARING-EQUIPPED RESIN PULLEY