Title:
MOLD AND PROCESS FOR PRODUCTION OF MOLD
Document Type and Number:
WIPO Patent Application WO/2011/135976
Kind Code:
A1
Abstract:
Disclosed is a process for producing a mold, in which the deterioration in adhesion properties of an aluminum layer can be prevented. Specifically disclosed is a process for producing a mold, which comprises the steps of (a) providing a mold base material (10), (b) forming a porous alumina layer (19) comprising a porous layer (19a) that defines multiple fine depressions (19p) and a barrier layer (19b) that is arranged at the bottoms of the multiple fine depressions (19p), and (c), subsequent to step (b), carrying out etching to expand the multiple fine depressions (19p) in the porous alumina layer (19), wherein the etching in step (c) is so carried out that the average depth of the multiple fine depressions (19p) does not exceed 1/7 of the average thickness of the barrier layer (19b) that has not been subjected to the etching yet.
Inventors:
ISURUGI AKINOBU
MINOURA KIYOSHI
HAYASHI HIDEKAZU
NAKAMATSU KENICHIRO
MINOURA KIYOSHI
HAYASHI HIDEKAZU
NAKAMATSU KENICHIRO
Application Number:
PCT/JP2011/058392
Publication Date:
November 03, 2011
Filing Date:
April 01, 2011
Export Citation:
Assignee:
SHARP KK (JP)
ISURUGI AKINOBU
MINOURA KIYOSHI
HAYASHI HIDEKAZU
NAKAMATSU KENICHIRO
ISURUGI AKINOBU
MINOURA KIYOSHI
HAYASHI HIDEKAZU
NAKAMATSU KENICHIRO
International Classes:
C25D11/24; B29C33/38; B29C39/26; C23C28/00; C25D11/04; C25D11/12; G02B1/11; G02B1/118; B29L11/00
Domestic Patent References:
| WO2010116728A1 | 2010-10-14 | |||
| WO2006059686A1 | 2006-06-08 | |||
| WO2010116728A1 | 2010-10-14 |
Foreign References:
| JP2005156695A | 2005-06-16 | |||
| JP2010090430A | 2010-04-22 | |||
| JP2001517319A | 2001-10-02 | |||
| JP2003531962A | 2003-10-28 | |||
| JP2005156695A | 2005-06-16 |
Attorney, Agent or Firm:
OKUDA SEIJI (JP)
Seiji Okuda (JP)
Seiji Okuda (JP)
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Claims: