Title:
MOLD RELEASE AGENT ADHESION STATE EVALUATION METHOD, LUBRICANT ADHESION STATE EVALUATION METHOD, AND MOLD RELEASE AGENT ADHESION STATE EVALUATION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/070261
Kind Code:
A1
Abstract:
This mold release agent adhesion state evaluation method is a method for evaluating the adhesion state of a mold release agent used in die casting and attached to a mold, the method comprising: a step for heating the mold; a step for attaching a mold release agent to the surface of the heated mold; a step for acquiring image data on the appearance of the surface of the mold to which the mold release agent is attached; a step for deriving, from color digitization information corresponding to the acquired image data on the appearance, the adhesion state of the mold release agent on the surface of the mold on the basis of the correlation between the color digitization information acquired in advance and the adhesion state of the mold release agent; and a step for outputting data regarding the derived adhesion state of the mold release agent.
Inventors:
TOMIMATSU HIROAKI (JP)
TSUJIMOTO TAKAHITO (JP)
TSUJIMOTO TAKAHITO (JP)
Application Number:
PCT/JP2023/029057
Publication Date:
April 04, 2024
Filing Date:
August 09, 2023
Export Citation:
Assignee:
MORESCO CORP (JP)
International Classes:
B22D17/20; B22D17/32
Attorney, Agent or Firm:
KITANO Shuhei et al. (JP)
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