Title:
MOLD RELEASE FILM, FILM LAMINATE, METHOD FOR PRODUCING MOLD RELEASE FILM, AND METHOD FOR PRODUCING FILM LAMINATE
Document Type and Number:
WIPO Patent Application WO/2021/019845
Kind Code:
A1
Abstract:
A novel mold release film which has excellent easy separability and is thus easily separated from a silicone adhesive layer, while being still able to be reduced in the amount of use of fluorinated silicone, and which is provided, on at least one surface of a base material film, with a mold release layer that is obtained by curing a mold release layer composition containing (A) a curable silicone having a fluorine substituent, (B) a curable silicone containing no fluorine substituent and (D) a curing catalyst. This mold release film is characterized in that fluorine atoms are unevenly distributed in the surface of the mold release layer in the concentration distribution of fluorine atoms in the thickness direction within the mold release layer.
Inventors:
OSEKI YOSUKE (JP)
Application Number:
PCT/JP2020/016391
Publication Date:
February 04, 2021
Filing Date:
April 14, 2020
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
B32B27/00; C08L83/08; C09D183/08
Domestic Patent References:
| WO2016152992A1 | 2016-09-29 | |||
| WO2019117059A1 | 2019-06-20 |
Foreign References:
| JP2015183041A | 2015-10-22 | |||
| JP2013510921A | 2013-03-28 | |||
| JP2011201035A | 2011-10-13 | |||
| JPH06295016A | 1994-10-21 | |||
| JPH07292081A | 1995-11-07 | |||
| JPH01313521A | 1989-12-19 | |||
| JP2000006324A | 2000-01-11 | |||
| EP0602731A2 | 1994-06-22 | |||
| US5391472A | 1995-02-21 |
Other References:
"Latest Trends in Conductive Polymer Technology", 1 June 1999, TORAY RESEARCH CENTER, INC.
See also references of EP 4005792A4
See also references of EP 4005792A4
Attorney, Agent or Firm:
TAKEUCHI, ICHIZAWA & ASSOCIATES (JP)
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