Title:
MOLD RELEASE FILM FOR RESIN SHEET MOLDING
Document Type and Number:
WIPO Patent Application WO/2022/085531
Kind Code:
A1
Abstract:
[Problem] The present invention provides a mold release film for resin sheet molding, said mold release film achieving a good balance between the handling properties of the mold release film and smoothness of both a mold release layer and the back surface of the mold release film, while being suppressed in unwinding electrification, thereby being free from risk of failure during the production of a resin sheet. [Solution] A mold release film for resin sheet molding, said mold release film comprising a back surface layer, a base material and a mold release layer, wherein: the base material is a polyester film which has a surface layer A that does not substantially contain inorganic particles and a surface layer B that contains particles; the mold release layer is superposed on the surface layer A; the back surface layer is superposed on the surface layer B; the mold release layer does not substantially contain particles; the mold release layer has an area surface roughness Sa of 7 nm or less, while having a maximum profile peak height of 50 nm or less; the back surface layer is a cured product of a back surface layer-forming composition; the back surface layer-forming composition contains particles and a binder resin; the back surface layer has a maximum profile peak height of 300 nm or less; and the number of profile peaks having a height of from 40 nm to 100 nm on the back surface layer is 1,000 per mm2 or more.
Inventors:
SHIGENO KENTO (JP)
MORI KENICHI (JP)
MORI KENICHI (JP)
Application Number:
PCT/JP2021/037852
Publication Date:
April 28, 2022
Filing Date:
October 13, 2021
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/00; B28B1/30; B32B27/36
Domestic Patent References:
| WO2019065214A1 | 2019-04-04 |
Foreign References:
| JP2016060158A | 2016-04-25 | |||
| JP2016221737A | 2016-12-28 |
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