Title:
MOLD RELEASE FILM
Document Type and Number:
WIPO Patent Application WO/2017/200102
Kind Code:
A1
Abstract:
A mold release film which comprises a base and a mold release layer that is provided on the base and contains a resin component and a filler, and wherein the ratio of the volume average particle diameter A (μm) of the filler to the mass B per 1 m2 (g/m2) of the mold release layer, namely the ratio A/B is 1 or less.
Inventors:
MORI SHUICHI (JP)
TAMURA RYO (JP)
OTOMO TAKEO (JP)
SASAKI WAKA (JP)
TAMURA RYO (JP)
OTOMO TAKEO (JP)
SASAKI WAKA (JP)
Application Number:
PCT/JP2017/018930
Publication Date:
November 23, 2017
Filing Date:
May 19, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B29C33/68; B32B27/00; B32B27/20; B32B27/36; H01L21/56
Domestic Patent References:
| WO2013183671A1 | 2013-12-12 |
Foreign References:
| JP2014212239A | 2014-11-13 | |||
| JP2009143091A | 2009-07-02 | |||
| JP2004344962A | 2004-12-09 | |||
| JP2004200467A | 2004-07-15 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
Download PDF:
Previous Patent: INFORMATION PROCESSING DEVICE, METHOD FOR CONTROLLING SAME, AND COMPUTER PROGRAM
Next Patent: DEMOLDING FILM
Next Patent: DEMOLDING FILM