Title:
MOLD RELEASE FILM
Document Type and Number:
WIPO Patent Application WO/2022/118755
Kind Code:
A1
Abstract:
[Problem] To provide a mold release film that has a light release force both before and after heating, is capable of having a light release force even when released at a high speed, and includes substantially no silicone.
[Solution] The mold release film according to claim 1, characterized by having a mold release layer laminated on a base material film, the mold release layer including at least a long-chain-alkyl-containing acrylic resin (A) and a crosslinking agent (B) and including substantially no silicone component, wherein the ratio a/b of the weight (a) of the long-chain-alkyl-containing acrylic resin to the weight (b) of the crosslinking agent included in the mold release layer satisfies the following Expression (I).
(I): 0.1 ≦ a/b ≦ 7.0.
Inventors:
ONO YUJI (JP)
NAKATANI MITSUHARU (JP)
NAKATANI MITSUHARU (JP)
Application Number:
PCT/JP2021/043425
Publication Date:
June 09, 2022
Filing Date:
November 26, 2021
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/00; B32B7/06; B32B27/26; B32B27/30; C08F20/10; C08L33/04; C09D7/63; C09D133/00; C09J7/38; C09J7/40
Domestic Patent References:
| WO2020129962A1 | 2020-06-25 |
Foreign References:
| JP2019181959A | 2019-10-24 | |||
| JP2019194337A | 2019-11-07 | |||
| JP2020050863A | 2020-04-02 |
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