Title:
MOLD RELEASE FILM
Document Type and Number:
WIPO Patent Application WO/2022/249899
Kind Code:
A1
Abstract:
[Problem] A mold release film is provided which, substantially silicone-free, has a light release force before and after heating, and a light release force even in the case of quick release. [Solution] This mold release film includes a base film and a mold release layer, wherein the mold release layer contains at least an acrylic resin (A), a crosslinking agent (B) and a mold release agent (C); the acrylic resin (A) contains at least a component A-1, represented in a specific chemical formula (chemical formula 1) and a component A-2, represented in (chemical formula 2), and in the mold release film, the substantially silicone-free mold release layer and the mold release layer is not stacked on the substrate film; the ratio a/b of the mass (a) of the acrylic resin (A) contained in the mold release layer and the mass (b) of the crosslinking agent (B) satisfies formula (I).
(I) 0.1 ≤ a/b ≤ 8.0
In formula (1) in the description, R1 is (CnH2n+1) (n an integer between 8-20) and R4 represents H or CH3. In formula (2) in the description, R2 is (CmH2mOH) (m an integer between 1-10), or H, and R4 represents H or CH3.
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Inventors:
ONO YUJI (JP)
NAKATANI MITSUHARU (JP)
NAKATANI MITSUHARU (JP)
Application Number:
PCT/JP2022/020199
Publication Date:
December 01, 2022
Filing Date:
May 13, 2022
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C09J7/40; B32B27/00; C08F220/18; C08F220/28; C08J7/04; C09D133/00; C09J7/38; C09K3/00
Domestic Patent References:
| WO2020129962A1 | 2020-06-25 |
Foreign References:
| JP2016190327A | 2016-11-10 | |||
| JP2018115224A | 2018-07-26 | |||
| JP2021098845A | 2021-07-01 |
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