Title:
MOLD RELEASE FILM
Document Type and Number:
WIPO Patent Application WO/2023/234417
Kind Code:
A1
Abstract:
Provided is a mold release film that comprises a biaxially oriented polypropylene film having a low thermal shrinkage rate at 150°C, comparable to that of a biaxially oriented PET film, and exceptional adhesiveness of a mold release layer. The mold release film includes a biaxially oriented layered polypropylene film that includes at least a substrate layer A and a surface layer B, and a mold release layer, wherein the biaxially oriented layered polypropylene film fulfills the following conditions (1)–(6). (1) The ratio of the thickness of the substrate layer A to the thickness of the entire film is 70%–98%. (2) The mesopentad fraction of a polypropylene resin that forms the substrate layer A is 97.0%–99.9%. (3) The mesopentad fraction of a polypropylene resin that forms the surface layer B is 80.0%–96.5%. (4) The surface orientation factor of the film, measured from the surface layer B side, is 0.0134 or less. (5) The thermal shrinkage rate at 150°C of the film in a longitudinal direction is 6.0% or less. (6) The thermal shrinkage rate at 150°C of the film in a width direction is 5.0% or less.
Inventors:
TANEKI KENSUKE (JP)
IMAI TORU (JP)
HORINOUCHI KAZUHITO (JP)
IMAI TORU (JP)
HORINOUCHI KAZUHITO (JP)
Application Number:
PCT/JP2023/020725
Publication Date:
December 07, 2023
Filing Date:
June 02, 2023
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/00; B29C55/12; B32B7/023; B32B7/028; B32B27/32; C08J7/04
Domestic Patent References:
| WO2019244708A1 | 2019-12-26 | |||
| WO2017169952A1 | 2017-10-05 | |||
| WO2018180164A1 | 2018-10-04 | |||
| WO2018142983A1 | 2018-08-09 |
Foreign References:
| JPH05177790A | 1993-07-20 | |||
| JPH11192680A | 1999-07-21 | |||
| JPH10180963A | 1998-07-07 | |||
| JP2015199228A | 2015-11-12 | |||
| JP2018141122A | 2018-09-13 |
Attorney, Agent or Firm:
USFI PATENT ATTORNEYS INTERNATIONAL OFFICE (JP)
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