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Title:
MOLD RELEASE TREATMENT METHOD, MOLD, METHOD FOR PRODUCING ANTI-REFLECTIVE FILM, MOLD RELEASE TREATMENT DEVICE, AND WASHING/DRYING DEVICE FOR MOLD
Document Type and Number:
WIPO Patent Application WO/2011/111669
Kind Code:
A1
Abstract:
The disclosed mold release treatment method includes: a step for preparing a mold release agent containing a solvent and a fluorine compound having mold release properties, and for preparing a mold (100) having a porous alumina layer (14) on the surface thereof; a step for imparting to the surface of the mold a solvent that can dissolve the fluorine compound; and a step for thereafter imparting the mold release agent to the surface of the mold (100) by means of a spray coating method. Through the disclosed method, it is possible to carry out mold release treatment—without unevenness—of the surface of a mold having a porous alumina layer (14) on the surface thereof.

Inventors:
HAYASHI HIDEKAZU
IMAOKU TAKAO
Application Number:
PCT/JP2011/055276
Publication Date:
September 15, 2011
Filing Date:
March 07, 2011
Export Citation:
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Assignee:
SHARP KK (JP)
HAYASHI HIDEKAZU
IMAOKU TAKAO
International Classes:
B29C33/58; B29C33/38; B29C33/62; B29C33/72; B29C39/26
Domestic Patent References:
WO2008001847A12008-01-03
WO2006059686A12006-06-08
WO2008001847A12008-01-03
Foreign References:
JP2010005841A2010-01-14
JPS6071464U1985-05-20
JP2005270801A2005-10-06
JPH11156865A1999-06-15
JP2001517319A2001-10-02
JP2003531962A2003-10-28
JP2005156695A2005-06-16
JPH0480440B21992-12-18
Other References:
See also references of EP 2546042A4
Attorney, Agent or Firm:
OKUDA SEIJI (JP)
Seiji Okuda (JP)
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Claims:



 
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