Title:
MOLD REPAIRING METHOD, MOLD AND MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2006/061907
Kind Code:
A1
Abstract:
The present invention provides a mold repairing method. This method is characterized by comprising a heat resistant inorganic adhesive filling step of filling a heat resistant inorganic adhesive (140) into cracks (122, 132) formed on the molding surface of a movable mold (120a) and a fixed mold (130a) in a mold (110a) for aluminum die casting. In the mold repairing method, since the heat resistant inorganic adhesive (140) is filled into the cracks (122, 132) formed on the molding surface of the movable mold (120a) or the fixed mold (130a), burrs and padding (Q) are not formed. Further, since burrs and padding (Q) are not adhered onto the surface of a molded product (Pa), in taking out the molded product (Pa) from the movable mold (120a) and the fixed mold (130a), damage to the movable mold (120a), the fixed mold (130a), and the molded product (Pa) does not occur.
Inventors:
KITAZAWA TOSHIAKI (JP)
Application Number:
PCT/JP2004/018415
Publication Date:
June 15, 2006
Filing Date:
December 09, 2004
Export Citation:
Assignee:
ASAHI CO LTD (JP)
KITAZAWA TOSHIAKI (JP)
KITAZAWA TOSHIAKI (JP)
International Classes:
B22C9/06; B22D17/22
Foreign References:
| JPH07237244A | 1995-09-12 | |||
| JPH0615653A | 1994-01-25 | |||
| JPH10244588A | 1998-09-14 | |||
| JPH08189415A | 1996-07-23 | |||
| JPH0988713A | 1997-03-31 | |||
| JP2003103343A | 2003-04-08 | |||
| JPH08174215A | 1996-07-09 |
Attorney, Agent or Firm:
Matsuo, Nobutaka (9862-60 Ochiai, Fujimi-machi, Suwa-gu, Nagano 14, JP)
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