Title:
MOLD FOR RESIN MOLDING AND RESIN MOLDED ARTICLE FORMED BY USING THE MOLD
Document Type and Number:
WIPO Patent Application WO/2007/015390
Kind Code:
A1
Abstract:
Disclosed is a mold for resin molding which can produce a resin molded article
having a precise shape without the occurrence of defective molding and can be
manufactured in a simple manner. Also disclosed is a resin molded article having
a hydrophilic property. A mold (10) for resin molding comprises a shaping die
(12). The shaping die (12) has a first heat-insulating layer (14) and a second
heat-insulating layer (16) on its inner side. The first heat-insulating layer
(14) is made of a heat-curable resin having a curing temperature of 200°C
or lower, and the second heat-insulating layer (16) is made of a mixture of a heat-curable
resin which is the same as that used for the first heat-insulating layer (14) and
a ceramic granule (18). The second heat-insulating layer (16) is formed in such
a manner that the surface has microasperities having an arithmetic average roughness
(Ra) of 11 to 13 μm and the maximum height (Pt) of 50 to 100 μm (wherein
Ra and Pt are as defined according to ISO 4287: '97). By using the mold (10),
the fluidability of a molted resin in the mold becomes better and it is possible
to produce a resin molded article which precisely copies the shape of the microasperities
of the second heat-insulating layer (16).
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Inventors:
SOGABE MITSUSHI (JP)
SUGITA TSUTOMU (JP)
SUGITA TSUTOMU (JP)
Application Number:
PCT/JP2006/314620
Publication Date:
February 08, 2007
Filing Date:
July 25, 2006
Export Citation:
Assignee:
TANAZAWA HAKKOSHA KK (JP)
SOGABE MITSUSHI (JP)
SUGITA TSUTOMU (JP)
SOGABE MITSUSHI (JP)
SUGITA TSUTOMU (JP)
International Classes:
B29C33/38; B29C33/42; B29C45/37
Foreign References:
| JP2001062847A | 2001-03-13 | |||
| JP2002292674A | 2002-10-09 |
Attorney, Agent or Firm:
OKADA, Masahiro (Iyo Building 2-21, Minamihonmachi 4-chome, Chuo-k, Osaka-shi Osaka54, JP)
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