Title:
MOLDED COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/234032
Kind Code:
A1
Abstract:
This molded component 1 comprises: an internal component module including a first molded part; solder parts; and a second molded part. Lead lines include a first lead line and a second lead line. The first molded part comprises a partitioning part that includes a first surface and a second surface. The first lead line has a first exposed part on the first surface, and the second lead line has a second exposed part on the second surface. The first lead line and the second lead line are disposed in positions that do not overlap in a planar view from a direction facing the first surface or a direction facing the second surface. The solder parts include a first solder part positioned on the first surface and a second solder part positioned on the second surface.
Inventors:
WEI LIN (JP)
KOYANO HIROYUKI (JP)
TERASAKA YUKITOSHI (JP)
KOBAYASHI TOSHINARI (JP)
YAMAO MEGUMI (JP)
KOYANO HIROYUKI (JP)
TERASAKA YUKITOSHI (JP)
KOBAYASHI TOSHINARI (JP)
YAMAO MEGUMI (JP)
Application Number:
PCT/JP2023/018447
Publication Date:
December 07, 2023
Filing Date:
May 17, 2023
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS (JP)
International Classes:
H01L23/04; G01P1/02
Foreign References:
| JP2020169832A | 2020-10-15 | |||
| JP2019207257A | 2019-12-05 | |||
| JP2021085740A | 2021-06-03 | |||
| JP2007121108A | 2007-05-17 | |||
| JP2006112801A | 2006-04-27 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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