Title:
MOLDED CONTAINER
Document Type and Number:
WIPO Patent Application WO/2023/127621
Kind Code:
A1
Abstract:
A cup-shaped molded container (2) formed by pressing a laminated packaging material (1) provided with: a barrier layer (13); a protective layer (16) comprising a synthetic resin film in which the tensile strength (δ1(MD)) and (δ1(MD)) in each of a flow direction (MD) and a width direction (TD) is 500–2500 MPa and in which the ratio therebetween (δ1(MD)/δ1(TD)) is 0.9–1.1, the protective layer (16) covering one surface of the barrier layer (13); and a sealant layer (11) for covering the other surface of the barrier layer (13). An identification mark (15) is printed in advance using printing ink on at least the barrier-layer (13)-side surface of the protective layer (13). The molded container (2) has excellent moldability as well as excellent dimensional stability in regard to the identification mark (15) displayed thereon.
Inventors:
NAEMURA TADASHI (JP)
Application Number:
PCT/JP2022/047021
Publication Date:
July 06, 2023
Filing Date:
December 21, 2022
Export Citation:
Assignee:
RESONAC PACKAGING CORP (JP)
International Classes:
B65D65/40; B65D1/00
Foreign References:
| JP2016137702A | 2016-08-04 | |||
| JPS58112732A | 1983-07-05 | |||
| JP2004058515A | 2004-02-26 |
Attorney, Agent or Firm:
MATSUMURA Naoto et al. (JP)
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