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Patent Searching and Data


Title:
MOLDED ELASTOMER FOR SEMICONDUCTOR PRODUCTION APPARATUS AND CROSSLINKABLE FLUOROELASTOMER COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2001/032782
Kind Code:
A1
Abstract:
A molded elastomer for semiconductor production apparatuses which is obtained by crosslinking and molding a crosslinkable fluoroelastomer composition comprising a crosslinkable fluoroelastomer ingredient and fine aluminum oxide particles, wherein the particles have an average particle diameter of 0.5 $g(m)m or smaller. The molding has excellent plasma resistance and is reduced in the number of particles generated by plasma irradiation. Hence, a molding for use in an extremely clean apparatus for semiconductor production, especially a sealing material for use in a plasma irradiation environment, is provided.

Inventors:
HIGASHINO KATSUHIKO (JP)
HASEGAWA MASANORI (JP)
TANAKA HIROYUKI (JP)
NOGUCHI TSUYOSHI (JP)
Application Number:
PCT/JP2000/007671
Publication Date:
May 10, 2001
Filing Date:
October 31, 2000
Export Citation:
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Assignee:
DAIKIN IND LTD (JP)
HIGASHINO KATSUHIKO (JP)
HASEGAWA MASANORI (JP)
TANAKA HIROYUKI (JP)
NOGUCHI TSUYOSHI (JP)
International Classes:
C08K3/22; (IPC1-7): C08L101/04; C08K3/22; H01L23/29
Foreign References:
US5358775A1994-10-25
JPH06244320A1994-09-02
JPH02212541A1990-08-23
JPH02155943A1990-06-15
JPS5874739A1983-05-06
JPS587441A1983-01-17
JP2000154369A2000-06-06
Other References:
See also references of EP 1253172A4
Attorney, Agent or Firm:
Asahina, Sohta (Tanimachi 2-chome Chuo-ku Osaka-shi Osaka, JP)
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