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Title:
MOLDED PRODUCT FOR HIGH VOLTAGE INSULATION, MANUFACTURING METHOD OF MOLDED PRODUCT FOR HIGH VOLTAGE INSULATION, AND METHOD FOR IMPROVING TRACKING RESISTANCE WITH MOLDED PRODUCT FOR HIGH VOLTAGE INSULATION
Document Type and Number:
WIPO Patent Application WO/2023/038094
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a molded product for high voltage insulation which contains a thermoplastic resin that exhibits high anti-tracking properties while maintaining mechanical properties. The molded product for high voltage insulation comprises a resin composition that contains at least a thermoplastic resin A, an inorganic filler B and a thermoplastic resin C other than the thermoplastic resin A and compatible with the inorganic filler B, wherein the inorganic filler B is covered by the thermoplastic resin C.

Inventors:
TERAOKA TAKANOBU (JP)
TAKAHASHI RYOTA (JP)
Application Number:
PCT/JP2022/033790
Publication Date:
March 16, 2023
Filing Date:
September 08, 2022
Export Citation:
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Assignee:
POLYPLASTICS CO (JP)
International Classes:
H01B3/00; C08J3/215; C08K3/013; C08K7/06; C08K9/04; C08L101/00
Foreign References:
JPH0971693A1997-03-18
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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