Title:
MOLDED PULP PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/145458
Kind Code:
A1
Abstract:
The present invention enables the realization of a thin and high-strength molded pulp product. The molded pulp product (MP2) has a thickness of 1.5 mm or less and a bending modulus of at least 800 MPa.
Inventors:
SAKAIRI KOJI (JP)
ISHII MEGUMI (JP)
ISHII MEGUMI (JP)
Application Number:
PCT/JP2023/000586
Publication Date:
August 03, 2023
Filing Date:
January 12, 2023
Export Citation:
Assignee:
TOPPAN INC (JP)
International Classes:
D21J5/00; B65D1/00
Domestic Patent References:
| WO2020196188A1 | 2020-10-01 | |||
| WO2019131048A1 | 2019-07-04 |
Foreign References:
| JP2002105897A | 2002-04-10 |
Attorney, Agent or Firm:
SUZUYE & SUZUYE (JP)
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