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Title:
MOLDED RARE-EARTH MAGNET AND LOW-TEMPERATURE SOLIDIFICATION AND MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/099495
Kind Code:
A1
Abstract:
[Problem] To provide a molded magnet which satisfies all of an increased film thickness, a heightened density, and improved magnetic properties (in particular, coercive force, residual magnetic flux density, and tight adhesion). [Solution] The molded magnet is a molded rare-earth magnet characterized by having a rare-earth magnet phase that comprises as the main component a nitride which contains Sm and Fe, having a density of 80% or higher of the theoretical density of a molded magnet constituted of the rare-earth magnet phase, and having a structure in which particles of Zn and/or Mn have been dispersed in the molded magnet.

Inventors:
KAWASHITA YOSHIO
TAKASHIMA KAZUHIKO
UEHARA YOSHITAKA
NANBU TOSHIKAZU
URAMOTO KIYOHIRO
Application Number:
PCT/JP2012/080635
Publication Date:
July 04, 2013
Filing Date:
November 27, 2012
Export Citation:
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Assignee:
NISSAN MOTOR (JP)
International Classes:
H01F1/06; C23C24/04; H01F1/055; H01F41/02; H02K15/03
Foreign References:
JP2005223263A2005-08-18
JP2004146713A2004-05-20
JP2007046155A2007-02-22
Other References:
ITO S ET AL.: "HIP sintering and magnetic properties of Sm2Fe17N3 with Zn additive", J MAGN MAGN MATER, vol. 270, no. 1/2, March 2004 (2004-03-01), CHIBA, JPN, pages 15 - 21, XP004488193
S. SUGIMOTO ET AL.: "Magnetic Properties of Sm.Fe.N Thick FilmMagnets Prepared by the Aerosol Deposition Method", IEEE TRANSACTIONS ON MAGNETICS, vol. 39, no. 5, September 2003 (2003-09-01), pages 2986 - 2988, XP011101161
RODEWALD W ET AL.: "Microstructure and magnetic properties of Zn- or Sn-bonded Sm2Fe17Nx magnets.", J APPL PHYS, vol. 73, no. 10, 15 May 1993 (1993-05-15), HANAU, DEU, pages 5899 - 5901, XP000381257
JOURNAL OF THE INSTITUTE OF ELECTRICAL ENGINEERS OF JAPAN A, vol. 124, no. 10, 2004, pages 887 - 891
See also references of EP 2800107A4
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
Hatta international patent business corporation (JP)
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Claims: