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Patent Searching and Data


Title:
MOLDING DEVICE, MOLDING METHOD, AND FIBER SHEET LAMINATE
Document Type and Number:
WIPO Patent Application WO/2021/106070
Kind Code:
A1
Abstract:
To enable suppression of the occurrence of wrinkles during bending and enable suppression of peeling between layers. The lamination device 1 as in the present disclosure comprises: a supply unit (2) that supplies and laminates fiber sheets (30); a press adjustment unit (6) or a heat adjustment unit (7) that adjusts the interlayer adhesive force that is applied to the laminated fiber sheets (30); and a control unit (8) that controls the press adjustment unit (6) or the heat adjustment unit (7) such that the interlayer adhesive force of a non-bending region (30B) that is different from a bending region (30A) in which the fiber sheets are bent becomes stronger than the interlayer adhesive force of the bending region (30A).

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Inventors:
SHIMIZU MASAHIKO (JP)
MANO SHOYA (JP)
KITAZAWA TOSHIKI (JP)
OZAKI RYOTA (JP)
HORIZONO HIDEKI (JP)
Application Number:
PCT/JP2019/046155
Publication Date:
June 03, 2021
Filing Date:
November 26, 2019
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B29C53/04; B29C70/28; B32B5/26; B32B7/04; B29K105/10
Foreign References:
JP2019151083A2019-09-12
JPH07108529A1995-04-25
JPH0747596A1995-02-21
US20080210372A12008-09-04
Other References:
See also references of EP 4000912A4
Attorney, Agent or Firm:
FUJITA, Takaharu (JP)
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