MOLDING DEVICE, MOLDING METHOD, IMPRINTING MOLD, AND IMPRINTING METHOD USING IMPRINTING MOLD

WIPO Patent Application WO/2013/047753

A1

Provided are a molding device and a molding method which are capable of molding a three-dimensional shape in a film having a fine pattern, an imprinting mold capable of transferring a fine pattern to the surface of a three-dimensional shape, and an imprinting method using the imprinting mold. A molding device for molding, in a film (20) having a fine pattern (20a), a three-dimensional shape with a thickness exceeding the thickness of the film (20) is configured from a pressurization unit (3) which comprises a pressurization chamber (30) for pressurizing the film (20) by a fluid from the fine pattern (20a) side, and a pressurization means (35) for adjusting the pressure of the fluid in the pressurization chamber (30), a pressure receiving stage (32) which has a pressure receiving surface (321) formed in the three-dimensional shape and supports the film (20), and a temperature adjusting unit which adjusts the temperature of the film (20). Using this molding device, the three-dimensional shape is molded in the film (20) on which the fine pattern is formed. This molded three-dimensional shape is applied as an imprinting mold to imprint technology.

KAWAGUCHI HIROSUKE (JP)
HAGINO TATSUYA (JP)
TANAKA SATORU (JP)

PCT/JP2012/075094

April 04, 2013

September 28, 2012

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SCIVAX CORP (JP)
KAWAGUCHI HIROSUKE (JP)
HAGINO TATSUYA (JP)
TANAKA SATORU (JP)

B29C59/02; B29C51/10; H01L21/027

JPS6416629A	1989-01-20
JP2008221643A	2008-09-25
JP2010175934A	2010-08-12

OKUDA Noritsugu (JP)
Okuda 律次 (JP)

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