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Patent Searching and Data


Title:
MOLDING DEVICE AND MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/168259
Kind Code:
A1
Abstract:
This molding device molds a metal pipe including a pipe portion, and is provided with: a first die and a second die which mutually constitute a pair and which, when closed, form a first cavity portion for forming the pipe portion, and a second cavity portion which communicates with the first cavity portion for forming a flange portion of the metal pipe; a drive mechanism which drives at least one of the first die and the second die in a direction causing the dies to mate with one another; and a gas supply portion which supplies a gas into a metal pipe material which is held between the first die and the second die and is heated. The first die and the second die each include flange molding surfaces which face one another and which form the second cavity portion, and a projecting portion which projects from one of the flange molding surfaces toward the other flange molding surface is formed on at least one of the flange molding surfaces of the first die and the second die.

Inventors:
NOGIWA KIMIHIRO (JP)
ISHIZUKA MASAYUKI (JP)
SAIKA MASAYUKI (JP)
UENO NORIEDA (JP)
Application Number:
PCT/JP2018/003956
Publication Date:
September 20, 2018
Filing Date:
February 06, 2018
Export Citation:
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Assignee:
SUMITOMO HEAVY INDUSTRIES (JP)
International Classes:
B21D26/047; B21D22/02
Foreign References:
JP2016129891A2016-07-21
JP2006061944A2006-03-09
JP2006122979A2006-05-18
JP2012000654A2012-01-05
JP2012000654A2012-01-05
Other References:
See also references of EP 3597323A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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