Title:
MOLDING DIE, PROCESS FOR PRODUCING THE SAME, AND PROCESS FOR PRODUCING MOLDED PRODUCT USING THIS DIE
Document Type and Number:
WIPO Patent Application WO/2006/028052
Kind Code:
A1
Abstract:
This invention provides a molding die, which is high in die processing efficiency and is free from electrifiation-derieved lowered processing efficiency and electrostatic discharge damage and has been processed by ion beam or electron beam irradiation, a process for producing the same, and a process for producing a molded product using the molding die. The molding die is for plastic resins or the like and comprises an electrically conductive glass base material and a cavity and/or a core having a size on the order of μm to nm engraved in a surface of the electrically conductive glass base material. The production process of a molding die for plastic resins or the like comprises applying an ion beam to a surface of an electrically conductive vanadate glass base material composed mainly of vanadium oxide (V2O5) and having an electrical conductivity of 1.0 × 10-1 S/cm to 1.0 × 10-8 S/cm to engrave a cavity and/or a core having a size on the order of μm to nm.
Inventors:
NISHIDA TETSUAKI (JP)
KOBAYASHI KEN-ICHI (JP)
MORISHIGE AKIRA (JP)
KOBAYASHI KEN-ICHI (JP)
MORISHIGE AKIRA (JP)
Application Number:
PCT/JP2005/016252
Publication Date:
March 16, 2006
Filing Date:
September 05, 2005
Export Citation:
Assignee:
KITAKYUSHU FOUNDATION (JP)
NISHIDA TETSUAKI (JP)
KOBAYASHI KEN-ICHI (JP)
MORISHIGE AKIRA (JP)
NISHIDA TETSUAKI (JP)
KOBAYASHI KEN-ICHI (JP)
MORISHIGE AKIRA (JP)
International Classes:
B29C33/38; B23K15/00; C03C3/12; C03C4/14; C03C23/00
Foreign References:
| JP2004034194A | 2004-02-05 | |||
| JP2004002181A | 2004-01-08 | |||
| JP2003034548A | 2003-02-07 |
Attorney, Agent or Firm:
Ishida, Kazuto (Kitakyushu Science and Research Park
Collaboration Center 2-1, Hibikino,
Wakamatsu-ku, Kitakyushu-sh, Fukuoka 35, JP)
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