Title:
MOLDING DIE, RESIN MOLDING DEVICE, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/224487
Kind Code:
A1
Abstract:
This molding die comprises a molding die body having a cavity MCa which holds an object Sa to be molded and to which a resin material T is supplied, wherein: the molding die body includes a pot block 71 having a pot 71a to which the resin material T is supplied, and a cull block UM that forms resin flow passages 71b, 71d, 81, 82, which cause the resin material T to flow from the pot 71a toward the cavity MCa, between the pot block 71 and the cull block; the pot block 71 has a protruding portion 71A protruding in a state in which the object Sa to be molded can be pushed; and an insertion member 71Aa inserted into a hole H formed in the object Sa to be molded is formed in the protruding portion 71A.
Inventors:
MIYAKAGE TAKAYUKI (JP)
YOSHIDA SYUHEI (JP)
ICHIHASHI HIDEO (JP)
YOSHIDA SYUHEI (JP)
ICHIHASHI HIDEO (JP)
Application Number:
PCT/JP2021/046086
Publication Date:
October 27, 2022
Filing Date:
December 14, 2021
Export Citation:
Assignee:
TOWA CORP (JP)
International Classes:
B29C45/02; B29C33/14; B29C33/68; B29C45/14; H01L21/56
Foreign References:
| JP2020064919A | 2020-04-23 | |||
| JP2019034445A | 2019-03-07 | |||
| JPH08142107A | 1996-06-04 |
Attorney, Agent or Firm:
R&C IP LAW FIRM (JP)
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