Title:
MOLDING DIE
Document Type and Number:
WIPO Patent Application WO/2018/230369
Kind Code:
A1
Abstract:
A molding die 1 comprises a fixed die 10 and a movable die 30. A molding cavity Ca is formed by combining the fixed die 10 and the movable die 30, and a molded article can be molded by filling a molding material into the molding cavity Ca. The movable die 30 includes a stepped columnar movable-side insert 37 and a stepped cylindrical outer diameter forming member 38 that are inserted into an insert insertion hole 343 of a movable-side template 34. The movable-side insert 37 includes: a large-diameter part 371 that is fitted into the insert insertion hole 343; and a small-diameter part 372 on which a transfer surface is formed for molding an optically functional surface of the molded article. The outer diameter forming member 38 includes: a small-diameter cylindrical part 381 that is disposed on the periphery of the small-diameter part 372 of the movable-side insert 37, and that is fitted into the insert insertion hole 343; and a flange part 382 on which a transfer surface is formed for molding an outer diameter part of the molded article.
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Inventors:
OTSUKA YOSHITAKA (JP)
YONEKUBO HIROSHI (JP)
YONEKUBO HIROSHI (JP)
Application Number:
PCT/JP2018/021198
Publication Date:
December 20, 2018
Filing Date:
June 01, 2018
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
B29C45/36; B29K23/00; B29L11/00
Domestic Patent References:
| WO2008078395A1 | 2008-07-03 |
Foreign References:
| JP2015140007A | 2015-08-03 | |||
| JP2010194779A | 2010-09-09 | |||
| JP2007261142A | 2007-10-11 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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