Title:
MOLDING MACHINE
Document Type and Number:
WIPO Patent Application WO/2023/149460
Kind Code:
A1
Abstract:
An injection device according to an embodiment comprises: a mold clamping device for clamping a mold; an injection device that slides a plunger into a sleeve, feeds a liquid material into the mold, and includes a sensor that measures the speed or position of the plunger; and a control device that controls the speed or position of the plunger, and includes a storage unit that stores a target value for the speed or position of the plunger, a comparison unit that compares an input value based on the measurement of the sensor with a target value, a calculation unit that calculates a command value for correcting the speed or position of the plunger based on the comparison result of the comparison unit, and a filter that performs a filtering process on the command value.
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Inventors:
MITA TETSUYA (JP)
Application Number:
PCT/JP2023/003178
Publication Date:
August 10, 2023
Filing Date:
February 01, 2023
Export Citation:
Assignee:
SHIBAURA MACHINE CO LTD (JP)
International Classes:
B22D17/32; B29C45/53; B29C45/76; B29C45/77
Foreign References:
| JPH05318542A | 1993-12-03 | |||
| JP2014131836A | 2014-07-17 | |||
| JPH0199107A | 1989-04-18 |
Attorney, Agent or Firm:
IKEGAMI, Tetsuma et al. (JP)
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