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Title:
MOLDING MATERIAL AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/097493
Kind Code:
A1
Abstract:
Provided are: a molding material containing a reinforcing fiber bundle (A) and a polyphenylene sulfide (B), wherein the melting point of said polyphenylene sulfide is 270 °C or less; and a molded article containing a reinforcing fiber and a polyphenylene sulfide, wherein the weight average fiber length of the reinforcing fiber is 0.3-3.0 mm, and the melting point of the polyphenylene sulfide is 270 °C or less, or the temperature-descending crystallization temperature of the polyphenylene sulfide is 190 °C or less. The generation of gas derived from the reinforcing fiber bundle or a sizing agent during a molding process can be reduced, and the surface roughness of the molded article due to the gas can be suppressed. Thus, a molding material having both of the surface smoothness and mechanical characteristics of the molded article can be obtained.

Inventors:
HIRATA SHIN (JP)
SUZUKI TAKAFUMI (JP)
HAMAGUCHI MITSUSHIGE (JP)
Application Number:
PCT/JP2021/038942
Publication Date:
May 12, 2022
Filing Date:
October 21, 2021
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08K7/02; C08J5/04; C08L45/00; C08L61/04; C08L63/00; C08L81/02
Foreign References:
JP2008231291A2008-10-02
JP2017160316A2017-09-14
JPS6114228A1986-01-22
JP2015105359A2015-06-08
JP2005015792A2005-01-20
JP2018100365A2018-06-28
JP2019011421A2019-01-24
JP2019108537A2019-07-04
JP2004059835A2004-02-26
JP2012158746A2012-08-23
JP2012158747A2012-08-23
JPH08269200A1996-10-15
JPS6445433A1989-02-17
Attorney, Agent or Firm:
BAN Toshimitsu et al. (JP)
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