Title:
MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/071263
Kind Code:
A1
Abstract:
A molding method may include forming a pattern on a surface of a substrate, the pattern and the surface of the substrate having an opposite polarity to each other, providing the substrate on which the pattern is formed with a liquid to form a liquid mold on either the surface of the substrate or the pattern, the liquid having a polarity identical to the polarity of the surface of the substrate or the polarity of the pattern and cooling the liquid mold at a temperature below a freezing point of the liquid to form a solid mold.
Inventors:
KIM JIN-HA (KR)
LEE SEUNG SEOB (KR)
LEE SEUNG SEOB (KR)
Application Number:
PCT/KR2010/008454
Publication Date:
June 16, 2011
Filing Date:
November 26, 2010
Export Citation:
Assignee:
KOREA ADVANCED INST SCI & TECH (KR)
International Classes:
B29C33/00; B29C41/00; B29C69/02; B29C70/68; B29C70/78
Foreign References:
| US20020034013A1 | 2002-03-21 | |||
| US4454081A | 1984-06-12 | |||
| GB2417461A | 2006-03-01 |
Attorney, Agent or Firm:
PARK, Jun Seok (11th Floor Seongdo Bldg.,587-23, Sinsa-dong, Gangnam-gu, Seoul 135-747, KR)
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