Title:
MOLDING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/124406
Kind Code:
A1
Abstract:
This molding resin composition contains: an epoxy resin; a curing agent; and an inorganic filler which contains one or more types of particle selected from the group consisting of calcium titanate particles and strontium titanate particles, wherein the total content of the calcium titanate particles and strontium titanate particles constitutes 60-80 vol% of the inorganic filler overall.
Inventors:
YAMAURA MASASHI (JP)
ARATA MICHITOSHI (JP)
NAKAYAMA AYUMI (JP)
KONDOH YUSUKE (JP)
NOGUCHI YUJI (JP)
ARATA MICHITOSHI (JP)
NAKAYAMA AYUMI (JP)
KONDOH YUSUKE (JP)
NOGUCHI YUJI (JP)
Application Number:
PCT/JP2021/045637
Publication Date:
June 16, 2022
Filing Date:
December 10, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08G59/40; C08K3/11; C08K5/10; C08L63/00; H01Q1/40
Domestic Patent References:
| WO2020066856A1 | 2020-04-02 | |||
| WO2020153068A1 | 2020-07-30 |
Foreign References:
| JP2017014406A | 2017-01-19 | |||
| CN103351578A | 2013-10-16 | |||
| US20150183952A1 | 2015-07-02 | |||
| JP2012216685A | 2012-11-08 | |||
| JP2011021166A | 2011-02-03 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
Download PDF: