Title:
MOLDING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/238950
Kind Code:
A1
Abstract:
A molding resin composition according to the present invention includes a curable resin, an inorganic filler, and a stress relaxer. The inorganic filler includes: at least one of silica particles and alumina particles; and calcium titanate particles. The stress relaxer includes at least one of an indene/styrene/coumarone copolymer, a trialkyl phosphine oxide, and a triaryl phosphine oxide.
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Inventors:
YAMAUCHI ARISA (JP)
YAMAURA MASASHI (JP)
HIRAI TOMOKI (JP)
TANAKA MIKA (JP)
NAKAYAMA AYUMI (JP)
SUKEGAWA YUTA (JP)
YAMAURA MASASHI (JP)
HIRAI TOMOKI (JP)
TANAKA MIKA (JP)
NAKAYAMA AYUMI (JP)
SUKEGAWA YUTA (JP)
Application Number:
PCT/JP2023/021622
Publication Date:
December 14, 2023
Filing Date:
June 09, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08L101/00; C08K3/22; C08K3/24; C08K3/36; C08L45/02; C08L61/28; C08L63/00; C08L67/00; H01L23/29; H01L23/31
Domestic Patent References:
WO2019131095A1 | 2019-07-04 |
Foreign References:
JP6870778B1 | 2021-05-12 | |||
JP2020122115A | 2020-08-13 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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