Title:
MOLDING SYSTEM, ABNORMALITY PREDICTION DEVICE, ABNORMALITY PREDICTION METHOD, PROGRAM, AND LEARNED MODEL
Document Type and Number:
WIPO Patent Application WO/2021/220719
Kind Code:
A1
Abstract:
A molding system (10) comprises a molding device (20) and an abnormality prediction device (40). The abnormality prediction device (40) acquires, as a first evaluation value, the maximum value of the pressure of a molding material inside a cavity of the molding device (20) detected from a pressure holding operation until a pressure-hold releasing operation by the molding device (20), and acquires prediction information for predicting the wear state of a gate of a die part of the molding device (20) on the basis of the first evaluation value.
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| JPH03219924 | MEASURING METHOD FOR MOLD CLAMPING FORCE |
Inventors:
BABA TOSHIYUKI (JP)
KIMURA KOUJI (JP)
TSUJI SHINTAROU (JP)
ADACHI TOMOYA (JP)
OKUBO YUSUKE (JP)
KIMURA KOUJI (JP)
TSUJI SHINTAROU (JP)
ADACHI TOMOYA (JP)
OKUBO YUSUKE (JP)
Application Number:
PCT/JP2021/014311
Publication Date:
November 04, 2021
Filing Date:
April 02, 2021
Export Citation:
Assignee:
JTEKT CORP (JP)
International Classes:
B22D17/32; B29C45/76
Foreign References:
| JP2020052821A | 2020-04-02 |
Attorney, Agent or Firm:
SHIN-EI PATENT FIRM, P.C. (JP)
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