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Patent Searching and Data


Title:
MOLECULAR MODULE ASSEMBLY DEVICE AND MOLECULAR MODULE ASSEMBLY METHOD
Document Type and Number:
WIPO Patent Application WO/2023/216692
Kind Code:
A1
Abstract:
The present disclosure relates to a molecular module assembly device and a molecular module assembly method. The molecular module assembly device comprises a plurality of microfluidic devices, the plurality of microfluidic devices being arranged in an array, each microfluidic device comprising a first electrode and a second electrode, and each microfluidic device being configured to control the movement of a droplet containing a molecular module in the microfluidic device by means of a voltage applied between the first electrode and the second electrode, so that at least two droplets in the molecular module assembly device are mixed to assemble at least two molecular modules.

Inventors:
ZHANG LUSHUAI (CN)
JIANG SHUO (CN)
Application Number:
PCT/CN2023/079787
Publication Date:
November 16, 2023
Filing Date:
March 06, 2023
Export Citation:
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Assignee:
DIGICODON TECH CO LTD (CN)
International Classes:
G11C13/02
Foreign References:
CN109415766A2019-03-01
CN112791753A2021-05-14
CN112711935A2021-04-27
CN110694702A2020-01-17
CN111600609A2020-08-28
US20180189448A12018-07-05
Attorney, Agent or Firm:
CCPIT PATENT AND TRADEMARK LAW OFFICE (CN)
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