Title:
MOLTEN METAL TRANSPORTATING LADLE AND METHOD OF TAPPING MOLTEN METAL
Document Type and Number:
WIPO Patent Application WO/2005/009650
Kind Code:
A1
Abstract:
A molten metal-transporting ladle of a pressure tapping type has a ladle body for receiving molten metal, an upper lid for covering an upper end opening portion of the ladle body, a lid for work openably covering an opening portion formed in a part of the upper lid, and a tapping portion extending from a lower end portion of the ladle body to above the ladle body. The lid (1) for work has lid bodies (13a, 13b) covering from the above the opening portion in the upper lid, a gas-introducing portion (11) provided in the top surface of the lid bodies (13a, 13b), and a heat-resistant layer provided inside the lid for work. The heat-resistant layer is constituted of an air-permeable fire-resistant material layer (12). A gas pressurizing the inside of the ladle body is introduced from the gas-introducing portion (11) into the ladle body through the air-permeable fire-resistant material layer (12). A heat-insulating material layer having an air-permeable heat-insulating material layer or a gas-circulating portion can be included between the air-permeable fire-resistant material layer (12) and the gas-introducing portion (11).
More Like This:
| WO/2000/041831 | HOT CHAMBER DIE CASTING OF SEMISOLID METALS |
| WO/2006/009154 | MOLTEN METAL FEED SYSTEM, CONTAINER, AND VEHICLE |
Inventors:
UKAJI BUNJI (JP)
OGAWA KENJI (JP)
MATSUMOTO TOSHIYUKI (JP)
NISHIHIRA AKIRA (JP)
MUKAI KATSUYOSHI (JP)
OGAWA KENJI (JP)
MATSUMOTO TOSHIYUKI (JP)
NISHIHIRA AKIRA (JP)
MUKAI KATSUYOSHI (JP)
Application Number:
PCT/JP2004/010901
Publication Date:
February 03, 2005
Filing Date:
July 23, 2004
Export Citation:
Assignee:
NIPPON CRUCIBLE CO (JP)
DAIKI ALUMINIUM IND (JP)
UKAJI BUNJI (JP)
OGAWA KENJI (JP)
MATSUMOTO TOSHIYUKI (JP)
NISHIHIRA AKIRA (JP)
MUKAI KATSUYOSHI (JP)
DAIKI ALUMINIUM IND (JP)
UKAJI BUNJI (JP)
OGAWA KENJI (JP)
MATSUMOTO TOSHIYUKI (JP)
NISHIHIRA AKIRA (JP)
MUKAI KATSUYOSHI (JP)
International Classes:
B22D35/00; B22D39/06; B22D41/00; B22D41/12; (IPC1-7): B22D39/06; B22D35/00; B22D41/12; B22D41/00
Domestic Patent References:
| WO2002051740A1 | 2002-07-04 |
Foreign References:
| JPH0252164A | 1990-02-21 | |||
| JP2001287021A | 2001-10-16 |
Other References:
None
See also references of EP 1649952A4
See also references of EP 1649952A4
Attorney, Agent or Firm:
Saegusa, Eiji (1-7-1 Doshomachi, Chuo-k, Osaka-shi Osaka 45, JP)
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