MONITORING DEVICE FOR DETECTING ELECTRONIC ELEMENT AFTER ADHESIVE DISPENSING AND WORKING METHOD THEREOF

WIPO Patent Application WO/2022/037044

A1

Disclosed in the present invention are a monitoring device for detecting an electronic element after adhesive dispensing and a working method thereof. The monitoring device for detecting the electronic element after adhesive dispensing comprises a workbench, a feeding disc fixedly connected to the workbench, a conveying device fixedly connected to the workbench, a basic assembly provided on the workbench, a feeding assembly located at one side of the conveying device, a carrying assembly provided at the other side of the conveying device and fixedly connected to the workbench, and a flipping assembly and a staggering assembly that are provided on the workbench. By means of the provided flipping assembly, a detection device can drive, by means of a driving motor, an adsorption device to perform flipping after completing the detection of a certain surface of the electronic element, such that an angle between the electronic element and the detection device can be adjusted, and the detection device completes the detection of other surfaces of the electronic element, thereby completing the comprehensive detection of the electronic element.

JP2023028005	PROCESSING SYSTEM AND PROCESSING METHOD
JP2002177839	SEALING GUN
JP7469270	Discharge device

WAN LING (CN)
CAO HONG (CN)

PCT/CN2021/080704

February 24, 2022

March 15, 2021

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NANJING YUZHI INTELLIGENT TECH CO LTD (CN)

B05C5/00; B05C9/00; B05C13/02; B65G47/248; B65G47/52

CN112124933A	2020-12-25
CN209912896U	2020-01-07
CN111521557A	2020-08-11
CN104229440A	2014-12-24
JPH0411967A	1992-01-16

NANJING TAIPU PATENT AGENCY (GENERAL PARTNERSHIP) (CN)

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