Title:
MONITORING METHOD AND MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/243564
Kind Code:
A1
Abstract:
A processing liquid is photographed while supplying the processing liquid to a substrate W, which is an object to be processed. At that time, a pattern light having a light and dark pattern is irradiated from an irradiation unit (70), and a reflected image or a projected image of the pattern light on the surface of the processing liquid is photographed using a camera (80). The flow state of the processing liquid is evaluated on the basis of photograph results by the camera (80). The processing liquid is photographed together with the pattern light, and it is therefore possible to detect minute changes in the flow state of the processing liquid on the basis of distortions in the pattern light.
More Like This:
JP2015127094 | POLISHING PAD |
JPH0210727 | METHOD AND APPARATUS FOR DIVIDING SEMICONDUCTOR WAFER |
JP5982650 | Wafer stripping device |
Inventors:
OKAMOTO SATOSHI (JP)
Application Number:
PCT/JP2023/021584
Publication Date:
December 21, 2023
Filing Date:
June 09, 2023
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; G01N21/956
Foreign References:
JP2019168460A | 2019-10-03 | |||
JP2019091816A | 2019-06-13 | |||
JP2020035961A | 2020-03-05 |
Attorney, Agent or Firm:
NISHIDA Takami (JP)
Download PDF:
Previous Patent: ORGANIC ELECTROLUMINESCENT ELEMENT AND ELECTRONIC DEVICE
Next Patent: DRYER, IMAGE FORMATION DEVICE, AND IMAGE FORMATION METHOD
Next Patent: DRYER, IMAGE FORMATION DEVICE, AND IMAGE FORMATION METHOD