Title:
MOSAIC DECAL PROBE
Document Type and Number:
WIPO Patent Application WO2004008492
Kind Code:
A3
Abstract:
The invention provides a mosaic decal probe, in which a mosaic of probe chips is assembled into a thin membrane (24) that is suspended in a ring (22) which is made of a material that has a TCE matching that of silicon. The membrane is mounted on the ring in tension, such as it stays in tension throughout a functional temperature range. In this way, the membrane exhibits a functional TCE matching that of the ring. The probe chip preferably has spring (27, 28) contacts on both sides. Apertures are cut in the membrane to allow the spring contacts on one side of the membrane to protrude through the membrane and contact the printed wiring board. The spring contacts which contact the printed wiring board are allowed to slide during temperature excursions, thereby decoupling the TCE mismatch between the probe chip and the printed wiring board. Two preferred embodiments are currently contemplated. A first embodiment of the invention uses a low-count mosaic comprised of few probe chips. The probe chips have the same TCE as the wafer under test. A second embodiment of the invention provides a high-count mosaic, using a high number of probe chips.
Inventors:
MOK SAMMY
CHONG FU-CHIUNG
FELDMAN IRA
CHONG FU-CHIUNG
FELDMAN IRA
Application Number:
PCT/US2003/021579
Publication Date:
May 06, 2004
Filing Date:
July 10, 2003
Export Citation:
Assignee:
NANONEXUS INC (US)
International Classes:
G01R1/073; G01R3/00; G01R31/28; (IPC1-7): G01R31/02
Foreign References:
| US5600257A | 1997-02-04 | |||
| US5977787A | 1999-11-02 |
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