Title:
MOSFET PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/041105
Kind Code:
A1
Abstract:
The present application provides a MOSFET packaging structure and a manufacturing method therefor, a circuit board assembly, and an electronic device. According to the MOSFET packaging structure, a MOSFET chip is mounted on a carrier chip, such that the interconnection distance between the MOSFET chip and the carrier chip is short, the parasitic inductance is small, and high-frequency driving is easy to achieve. Moreover, three conductive members are mounted on a second surface of the MOSFET chip, and are electrically connected to an input pad, an output pad, and a ground pad of the MOSFET chip, respectively, and the conductive members not only have high current carrying capacity, but also can reduce the resistance of the interconnection, reduce the heat generation of the MOSFET chip, and improve the heat dissipation performance of the MOSFET chip. In addition, the MOSFET packaging structure has a small packaging volume, which is conducive to miniaturization design.
Inventors:
WANG QUANLONG (CN)
HUANG SONG (CN)
HUANG SONG (CN)
Application Number:
PCT/CN2023/099537
Publication Date:
February 29, 2024
Filing Date:
June 09, 2023
Export Citation:
Assignee:
HONOR DEVICE CO LTD (CN)
International Classes:
H01L23/13
Foreign References:
| US20170256473A1 | 2017-09-07 | |||
| CN113785393A | 2021-12-10 | |||
| US20040089464A1 | 2004-05-13 |
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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