Title:
MOUNTING APPARATUS, MOUNTING METHOD, AND METHOD FOR MEASURING HEIGHT OF SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/113241
Kind Code:
A1
Abstract:
A mounting apparatus according to the present invention comprising: a lifting/lowering apparatus for lifting and lowering a holding member holding a component with respect to a substrate; a contact detecting unit for detecting contact between the holding member or the component being held by the holding member and the substrate; and a control unit which sets a mounting height for the component in accordance with the substrate height, causes the holding member holding the component to be lowered to the mounting height by the lifting/lowering apparatus, and, upon detecting the contact, releases and mounts the component. The control unit acquires the height of the holding member when the holding member is lowered by the lifting/lowering apparatus and the contact is detected, and measures the substrate height on the basis of the height of the holding member.
Inventors:
SENGA AKIHIRO (JP)
MIZUNO TAKAYUKI (JP)
MIZUNO TAKAYUKI (JP)
Application Number:
PCT/JP2020/044042
Publication Date:
June 02, 2022
Filing Date:
November 26, 2020
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/08; H05K13/04
Domestic Patent References:
| WO2018179317A1 | 2018-10-04 |
Foreign References:
| JP2000269692A | 2000-09-29 | |||
| JP2000299597A | 2000-10-24 | |||
| JP2012094673A | 2012-05-17 | |||
| JP2009027015A | 2009-02-05 |
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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