Title:
MOUNTING BASE, SUBSTRATE PROCESSING DEVICE, EDGE RING, AND EDGE RING TRANSFER METHOD
Document Type and Number:
WIPO Patent Application WO/2020/050080
Kind Code:
A1
Abstract:
A mounting base for mounting a substrate to be subjected to predetermined processing. The mounting base comprises: an electrostatic chuck for electrostatically attracting the substrate; a first edge ring which is disposed around the substrate and is transferrable; a second edge ring fixed around the first edge ring; a lifter pin for lifting and lowering the first edge ring; a first electrode disposed in a position opposing the first edge ring of the electrostatic chuck to electrostatically attract the first edge ring; and a second electrode disposed in a position opposing the second edge ring of the electrostatic chuck to electrostatically attract the second edge ring.
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Inventors:
SASAKI YASUHARU (JP)
UCHIDA YOHEI (JP)
UCHIDA YOHEI (JP)
Application Number:
PCT/JP2019/033265
Publication Date:
March 12, 2020
Filing Date:
August 26, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/3065; H01L21/677; H01L21/683
Foreign References:
| JP2012146743A | 2012-08-02 | |||
| JP2012216614A | 2012-11-08 | |||
| JP2018010992A | 2018-01-18 | |||
| JPH10265977A | 1998-10-06 | |||
| JP2010165798A | 2010-07-29 | |||
| JP2010251723A | 2010-11-04 | |||
| JP2018125519A | 2018-08-09 | |||
| US20170213758A1 | 2017-07-27 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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