Title:
MOUNTING DEVICE AND MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/239324
Kind Code:
A1
Abstract:
The purpose of this invention is to provide a mounting device and a mounting method which maintain stability of support for information acquisition devices to achieve highly-precise information acquisition. This invention provides a mounting device which mounts a plurality of information acquisition devices. The mounting device comprises a housing made of resin. The housing is provided with a fixing portion for fixing the plurality of information acquisition devices. The fixing portion is formed of a metal member fixed to the housing. Moreover, this invention provides a mounting method for mounting a plurality of cameras to a housing, the method comprising: insert-molding an integrated metal member in the housing made of resin; and fixing the plurality of cameras to the metal member obtained through the insert molding.
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Inventors:
HIROHATA SHIGETO (JP)
OHSUMI KEN (JP)
OKA NAOKI (JP)
OHSUMI KEN (JP)
OKA NAOKI (JP)
Application Number:
PCT/JP2022/003947
Publication Date:
November 17, 2022
Filing Date:
February 02, 2022
Export Citation:
Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
B62J23/00; B60R1/20; B62J45/00; B62J45/42; G01C3/06
Domestic Patent References:
| WO2019224960A1 | 2019-11-28 | |||
| WO2019186949A1 | 2019-10-03 | |||
| WO2017221410A1 | 2017-12-28 |
Foreign References:
| JP2001242521A | 2001-09-07 | |||
| JP2020006876A | 2020-01-16 | |||
| JP2019055646A | 2019-04-11 | |||
| JP2017202810A | 2017-11-16 |
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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