Title:
MOUNTING DEVICE, MOUNTING SYSTEM, AND INSPECTION AND MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/014505
Kind Code:
A1
Abstract:
This mounting device used in a mounting system comprises: a supply unit that holds components; a mounting unit that retrieves components from the supply unit and mounts them on to a target mounting object; an inspection imaging unit that captures images of the target mounting object; and a control unit that executes shortage inspections processing, whereby captured images of the target mounting object are used and component shortages upon the target mounting object are detected, and, if a component is missing, controls the mounting unit to retrieve the missing component from the supply unit and mount same upon the target mounting object.
Inventors:
INAGAKI MITSUTAKA (JP)
OYAMA SHIGETO (JP)
NARITA HARUNA (JP)
OYAMA SHIGETO (JP)
NARITA HARUNA (JP)
Application Number:
PCT/JP2019/028508
Publication Date:
January 28, 2021
Filing Date:
July 19, 2019
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/08
Domestic Patent References:
WO2017141377A1 | 2017-08-24 | |||
WO2015040667A1 | 2015-03-26 | |||
WO2011043080A1 | 2011-04-14 | |||
WO2015040667A1 | 2015-03-26 | |||
WO2017033268A1 | 2017-03-02 |
Foreign References:
JP2007214212A | 2007-08-23 | |||
JP2007158052A | 2007-06-21 | |||
JP2000013097A | 2000-01-14 | |||
JPH04324999A | 1992-11-13 |
Other References:
See also references of EP 4002977A4
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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