Title:
MOUNTING DEVICE, MOUNTING SYSTEM, AND INSPECTION/MOUNTING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/024296
Kind Code:
A1
Abstract:
A mounting device according to the present disclosure is used in a mounting system comprising a plurality of mounting devices which perform a mounting process on a mounting object. This mounting device comprises: a mounting unit that collects a component from a supply unit holding the component, and that performs a mounting process on the mounting object; an inspection unit that inspects the component disposed on the mounting object using reference information; and a control unit that, when the reference information is updated after an error has been detected with the component subjected to the mounting process prior to the current mounting device, causes the inspection unit to inspect the component subjected to the mounting process prior to the current mounting device using the updated reference information.
Inventors:
INAGAKI MITSUTAKA (JP)
OYAMA SHIGETO (JP)
NARITA HARUNA (JP)
OYAMA SHIGETO (JP)
NARITA HARUNA (JP)
Application Number:
PCT/JP2019/030457
Publication Date:
February 11, 2021
Filing Date:
August 02, 2019
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H05K13/08
Foreign References:
| JP4788678B2 | 2011-10-05 | |||
| JP2003332799A | 2003-11-21 | |||
| JP4775339B2 | 2011-09-21 | |||
| JP2011091181A | 2011-05-06 | |||
| JPS5713441B2 | 1982-03-17 | |||
| JPS63314900A | 1988-12-22 | |||
| JP2007157817A | 2007-06-21 | |||
| JP2014022681A | 2014-02-03 |
Other References:
See also references of EP 4009759A4
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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