Title:
MOUNTING METHOD FOR INTEGRATED CIRCUIT CHIP
Document Type and Number:
WIPO Patent Application WO/2012/009864
Kind Code:
A1
Abstract:
A mounting method for integrated circuit(IC) chips is provided. Said method includes: preparing some IC chips, the backsides of which are attached to the surface of a mounting adhesive tape(1); printing conductive bumps(4) on said chips' connection points(3); attaching an adhesive film(2) on the front side of said IC chips; tearing off said mounting adhesive tape(1); separating said adhesive film(2) from said IC chips which need to be mounted; sucking said IC chips from the backsides and transferring them to a substrate(5) and enabling compression joint between said connection points(3), which are on the front sides of said IC chips and with said conductive bumps(4) and weld spots on said substrate(5). The present invention enables efficient mounting for chips, decreases production cost, enhances connection reliability and is fit for fabricating smart card modules.
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Inventors:
CHEN ZEPING (CN)
LUO DECAI (CN)
LUO DECAI (CN)
Application Number:
PCT/CN2010/075498
Publication Date:
January 26, 2012
Filing Date:
July 28, 2010
Export Citation:
Assignee:
ZHONGSHAN HANRUN ELECTRONICS CO LTD (CN)
CHEN ZEPING (CN)
LUO DECAI (CN)
CHEN ZEPING (CN)
LUO DECAI (CN)
International Classes:
H01L21/78; H01L21/68
Foreign References:
| US20040175903A1 | 2004-09-09 | |||
| CN1180242A | 1998-04-29 | |||
| CN101261934A | 2008-09-10 |
Attorney, Agent or Firm:
JIAQUAN IP LAW FIRM (CN)
广州嘉权专利商标事务所有限公司 (CN)
广州嘉权专利商标事务所有限公司 (CN)
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Claims: