MOUNTING STRUCTURE AND MANUFACTURING METHOD FOR SAME

Title:

MOUNTING STRUCTURE AND MANUFACTURING METHOD FOR SAME

Document Type and Number:

WIPO Patent Application WO/2013/038594

Kind Code:

A1

Abstract:

Provided is a mounting structure wherein an electronic component such as a semiconductor chip having a weak film is mounted on a substrate such as a circuit board, said mounting structure capable of increasing connection reliability. A junction that connects electrode terminals (4) of the electronic component (1) and electrode terminals (5) of the substrate (2) contains an alloy (8) and a metal (9) of lower modulus of elasticity than the alloy (8), and has a cross-sectional structure in which the alloy (8) is surrounded by the metal (9) of lower modulus of elasticity.

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Inventors:

SAKURAI DAISUKE
USIROKAWA KAZUYA
HAGIHARA KIYOMI

Application Number:

PCT/JP2012/005026

Publication Date:

March 21, 2013

Filing Date:

August 08, 2012

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Assignee:

PANASONIC CORP (JP)
SAKURAI DAISUKE
USIROKAWA KAZUYA
HAGIHARA KIYOMI

International Classes:

H01L21/60

Foreign References:

JP2006156492A	2006-06-15
JP2002280407A	2002-09-27

Attorney, Agent or Firm:

MORIMOTO INT'L PATENT OFFICE (JP)
Patent business corporation Morimoto international patent firm (JP)

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