Title:
MOUNTING STRUCTURE AND NANOPARTICLE MOUNTING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2019/198328
Kind Code:
A1
Abstract:
The present invention uses a mounting structure which comprises: a semiconductor element that has an element electrode; a metal member; and a sintered body which bonds the semiconductor element and the metal member with each other. This mounting structure is configured such that: the sintered body contains a first metal and a second metal that is solid-solved in the first metal; the diffusion coefficient of the second metal in the first metal is higher than the self-diffusion coefficient of the first metal; and the content of the second metal with respect to the total mass of the first metal and the second metal in the sintered body is not more than the solid solubility limit of the second metal in the first metal.
Inventors:
HINE KIYOHIRO
KITAURA HIDETOSHI
FURUSAWA AKIO
KITAURA HIDETOSHI
FURUSAWA AKIO
Application Number:
PCT/JP2019/005254
Publication Date:
October 17, 2019
Filing Date:
February 14, 2019
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L21/52; B22F1/054; B22F1/10; B22F7/08; B82Y10/00; C22C5/06; C22C9/00
Domestic Patent References:
| WO2018116813A1 | 2018-06-28 | |||
| WO2017222010A1 | 2017-12-28 |
Foreign References:
| JP2012178507A | 2012-09-13 | |||
| JP2011029472A | 2011-02-10 | |||
| JP2016033992A | 2016-03-10 | |||
| JP2015004122A | 2015-01-08 |
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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