Title:
MOUNTING SUBSTRATE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/151796
Kind Code:
A1
Abstract:
A mounting substrate according to one embodiment of the present technology is provided with a wiring substrate (30), a fine L/S layer (40) that is formed in contact with the upper surface of the wiring substrate, and a plurality of elements (12, 13) that are arranged in a matrix on the upper surface of the fine L/S layer. The wiring substrate has a plurality of first wires (SigB1, Gate2), and a plurality of vias (14) of which a plurality are provided for each first wire and which are arranged at a period that is an integer multiple of the array period of the elements. The elements which are adjacent on the fine L/S layer are electrically connected, via one or more second wires (16) in the fine L/S layer, to a common via.
Inventors:
AOYAGI AKIYOSHI (JP)
Application Number:
PCT/JP2015/057847
Publication Date:
October 08, 2015
Filing Date:
March 17, 2015
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
G09F9/30; G09F9/33; H01L33/00; H05K3/46
Foreign References:
| JP2012227514A | 2012-11-15 | |||
| JP2012142376A | 2012-07-26 | |||
| JP2010015163A | 2010-01-21 | |||
| JP2006179942A | 2006-07-06 | |||
| JP2005033141A | 2005-02-03 | |||
| JP2014011275A | 2014-01-20 | |||
| JP2003115613A | 2003-04-18 | |||
| JP2009037164A | 2009-02-19 |
Other References:
See also references of EP 3128504A4
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
Patent business corporation wings international patent firm (JP)
Patent business corporation wings international patent firm (JP)
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