Title:
MULTI-CHIP MODULE
Document Type and Number:
WIPO Patent Application WO/2023/214468
Kind Code:
A1
Abstract:
A multi-chip optical module (2) obtained by packaging a plurality of IC chips (201A, 201B, 201C) mounted on a single substrate (101) includes: a lid component (203) that forms a housing space (S) for the plurality of IC chips (201A, 201B, 201C) together with the substrate (101) and has protrusions (111, 112, 113) protruding toward the IC chips (201A, 201B, 201C); and an adhesive layer (104A, 104B, 104C) that is formed between the protrusion (111, 112, 113) and the IC chip (201A, 201B, 201C). The protruding lengths of the protrusions (111, 112, 113) differ according to the height of the protrusions (111, 112, 113) with respect to the substrate (101).
Inventors:
KIKUCHI KIYOFUMI (JP)
TSUZUKI KEN (JP)
YAMADA TAKASHI (JP)
TAKAHASHI MASAYUKI (JP)
TSUZUKI KEN (JP)
YAMADA TAKASHI (JP)
TAKAHASHI MASAYUKI (JP)
Application Number:
PCT/JP2022/019601
Publication Date:
November 09, 2023
Filing Date:
May 06, 2022
Export Citation:
Assignee:
NIPPON TELEGRAPH & TELEPHONE (JP)
International Classes:
H01S5/026; H01S5/024
Domestic Patent References:
| WO2021215187A1 | 2021-10-28 | |||
| WO2018079362A1 | 2018-05-03 |
Foreign References:
| US20180331011A1 | 2018-11-15 | |||
| JP2021111718A | 2021-08-02 |
Attorney, Agent or Firm:
TANI & ABE, P.C. (JP)
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