Title:
MULTI-CHIP PACKAGING STRUCTURE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/112780
Kind Code:
A1
Abstract:
A multi-chip packaging structure and an electronic device comprising said multi-chip packaging structure. The multi-chip packaging structure (10) comprises a first chip (11) and a second chip (12), the first chip (11) comprising a ground end (11a), and the second chip (12) comprising a signal transmission end (T), the signal transmission end (T) being in communication with the ground end (11a); the signal transmission end (T) outputs a first signal to the ground end (11a), the first signal acting as a ground signal of the first chip (11), and the first signal being a varying signal. The electronic device (100) comprises the multi-chip packaging structure (10).
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Inventors:
LIU XUECHUN (CN)
Application Number:
PCT/CN2015/099532
Publication Date:
July 21, 2016
Filing Date:
December 29, 2015
Export Citation:
Assignee:
SHENZHEN XINWEI TECHNOLOGY CO LTD (CN)
International Classes:
H01L25/00; G06F3/041; H01L23/60
Foreign References:
| CN104538385A | 2015-04-22 | |||
| CN204464273U | 2015-07-08 | |||
| CN103376970A | 2013-10-30 | |||
| CN101447475A | 2009-06-03 | |||
| CN1983793A | 2007-06-20 | |||
| JPH0355617A | 1991-03-11 |
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