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Patent Searching and Data


Title:
MULTI-LAYER FILM, PACKAGING MATERIAL, AND PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/032580
Kind Code:
A1
Abstract:
The present disclosure pertains to a multi-layer film comprising: a first outer layer, which is a heat seal layer, containing a propylene homopolymer (A), a propylene/ethylene random copolymer (B), and an antiblocking agent (C); an inner layer containing a propylene/ethylene block copolymer (D) and an ethylene/propylene copolymer elastomer (E); and a second outer layer containing a propylene homopolymer (A) and a propylene/ethylene random copolymer (B), in this order, wherein the content of component (C) is 0.5-3.0 parts by mass with respect to 100 parts by mass of the total amount of components (A) and (B), and component (C) contains, with respect to the total amount of component (C), 45-75 mass% of particles (C1) having an average particle size of 1.0-4.0 μm, and 55-25 mass% of particles (C2) having an average particle size of more than 4.0 μm and not more than 7.0 μm.

Inventors:
OOKI TOMOKO (JP)
HAMADA DAISUKE (JP)
Application Number:
PCT/JP2022/029819
Publication Date:
March 09, 2023
Filing Date:
August 03, 2022
Export Citation:
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Assignee:
TOPPAN INC (JP)
International Classes:
B32B27/32; B65D65/02
Domestic Patent References:
WO2004071375A12004-08-26
Foreign References:
JPH10166527A1998-06-23
JP2000309644A2000-11-07
JP2020151907A2020-09-24
JP2009143118A2009-07-02
Other References:
"Handbook of Polymer Analysis and Characterization", 10 May 2013, article "Conference on Polymer Analysis and Characterization", pages: 412 - 413
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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